Pixel positioning systems and methods

ABSTRACT

A manufacturing process for sheet or shaped work products includes advancing the work product in a direction along a processing path; establishing a reference line with respect to the processing path; capturing visual data related to the work product; converting the visual data into a pixel array; and setting a predetermined line of pixels to correspond with the reference line.

TECHNICAL FIELD

The field of this disclosure relates to a detection and control systemfor the continuous manufacture of work products including sheet materialand/or geometrically shaped structural products. More specifically, thisdisclosure relates to systems and methods for pixel positioning on theproducts.

BACKGROUND

Continuously manufactured products, can include profile shapes and webmaterials. Profile shapes may take many forms such as tubing, hose,pipe, and plastic lumber with dimensions such as 2×4's and 4×4's, whileweb materials are typically a continuous sheet of material of a givenwidth. Profiled shaped materials can be any shape, but are usuallyelongated products with cross-sections that are generally square,rectangular, or circular. Looking down the length of the product, theprofile shape can have four walls that define a square (or rectangle),with a hollow center. The opposing walls generally will have equal crosssectional lengths and each wall will usually have an equal thicknessmeasured from the inside surface of the wall to the outside surface orouter periphery of the wall.

For example, 4×4 extruded polymer lumber may be of any length, but thewidth and depth are generally both 4 inches, measured about theperimeter. Thus, the product has four sides that are all equal in length(hence 4×4), and each side has a thickness (which is generally uniformfor all the walls).

A continuously formed product with a shaped profile generally begins inliquid form (or amorphous solid) as a result of heating in an extruder.The raw material is introduced to the extruder in pellet form. An exitorifice of the extruder includes a center shape called a mandrel and anadjustable outer ring called a die. These two objects can have adiscernable space between them and the extruder injects the liquefiedproduct material through the space. When the liquefied product isproperly cooled, it can form a desired shape of the final work product.The mandrel can define the inner walls of the product and the die candefine the outer walls of the product. As the desired shape is acquired,the amorphous solid material can be sent into a cooler for hardening.

The work product can move through these operations by use of a pullingdevice. The pulling device can be located toward the end of themanufacturing process, and can pull the hardened product down theprocessing line. One concern in this process is maintaining a desiredshape and wall thickness for each side of the product. Wall thicknesscan be increased or decreased by changing the speed of the pullingdevice. Similar to stretching a piece of bubble gum, by increasing thespeed of the pulling device, the amorphous portion of the product willtypically stretch, thereby reducing the wall thickness of the finalproduct. Alternatively, slowing the pulling device speed can increasethe wall thickness of the final product.

While the pulling device has the ability to increase or decrease thewall thickness by changing speed, a pulling device can generally onlysimultaneously change the thickness of all sides of the product.Therefore, if one side has an appropriate thickness, but another sidedoes not, the pulling device will generally be of little value.Similarly, measuring the wall thickness can be a difficult task, as manymeasuring devices require contact with the product, and others do notprovide accurate readings.

Web materials can be made of any of a plurality of materials includingpaper, plastic, carpet, or other materials. Web materials (as well asshaped profiles) may have a plurality of different components that needmeasurement and adjustment for quality control and cost management.These components can include length control, width control, wallthickness control, coating thickness control, film thickness control,and opacity control.

Historically, nuclear measurement devices, ultra sonic sensors haveprovided measurement and control of the dimensions of continuouslyformed work products such as web materials and shaped profiles. Whilethese techniques can have benefits, they also have drawbacks. Withshaped profiles, this measurement is generally taken on cylindrical pipeand some non-cylindrical tubing because of the symmetry of the products.Shaped profiled work products that have sharp angles and several sides,such as continuously formed lumber products, do not easily lendthemselves to sensors that usually contact the product to measure wallthickness. Using a single sensor to measure wall thickness of anymultisided object usually can be unreliable. In addition, contact by thesensor against the surface of the product has the potential to alter theposition or shape of the product, thus decreasing the sensor's accuracy.

Additionally, there is often difficulty in the manufacturing process dueto misplacement of the die with respect to the mandrel. This can resultin varying wall thickness of each side of the work product. As statedabove, work products having continuously manufactured walls of differentthickness usually renders the pulling device unable to effectivelycorrect wall thickness errors.

Further, additional problems can occur during other types of productionactivities. With continuously manufactured products, such as sheetmaterials and shaped profiles, defects may exist on the material duringmanufacture. The defects can occur in any of a variety of ways includingdimension defects, coating thickness defects, film thickness defects,and opacity defects. One problem that exists is locating theirregularity of the work product so that a correction to the productionprocess can be made

Thus, a heretofore unaddressed need exists in the industry to addressthe aforementioned deficiencies and inadequacies.

SUMMARY

One embodiment discussed in this disclosure includes size detection andcontrol method of a work product in a manufacturing process. Thisembodiment includes advancing a work product in a direction along aprocessing path; determining a reference line with respect to theprocessing path; capturing visual data related to the work product;converting the visual data into a pixel array; and setting apredetermined line of pixels to correspond with the reference line.

Also included in this disclosure is a system for manufacturing a shapedprofile material. One embodiment of this system includes a mandrel and adie that are configured to define the boundaries of a shaped profile.The system also includes a visual data capture device configured tocapture visual data from the material, and first logic configured toconvert the visual data from into a pixel array. Finally, a materialadvancing device is included and configured to advance shaped profilematerial in a direction along a processing path.

Other systems, methods, features and/or advantages will be or may becomeapparent to one with skill in the art upon examination of the followingdrawings and detailed description. It is intended that all suchadditional systems, methods, features and/or advantages be includedwithin the scope of the present invention and be protected by theaccompanying claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The components in the drawings are not necessarily to scale relative toeach other. Like reference numerals designate corresponding partsthroughout the several views.

FIG. 1 is a functional block diagram illustrating interconnectivity of apixel positioning integrated in a network environment.

FIG. 2 is a system for manufacturing continuously produced workproducts, which can be integrated in the system from FIG. 1.

FIG. 3 is an output data graph that may be produced during manufacturingcontinuously produced work products from systems such as those from FIG.2.

FIG. 4 is a functional diagram illustrating one approach for capturingdata in manufacturing continuously produced work products, as shown inFIG. 2.

FIG. 5 is an alternate functional diagram illustrating another approachfor capturing data in manufacturing continuously produced work products,as shown in FIG. 2.

FIG. 6 is a functional block diagram of one embodiment of a system formanufacturing shaped profiled materials, similar to the system from FIG.2.

FIG. 7 is a functional block diagram of one embodiment of a mandrel anddie, located in the system of FIG. 6.

FIG. 8 is a functional block diagram of one embodiment of a mandrel anddie, similar to the mandrel and die of FIG. 7, with the die out ofplace.

FIG. 9 is a functional block diagram of the system of FIG. 6, with a diesetting system.

FIG. 10 is a functional block diagram of one embodiment of componentsthat may be present in the die setting system of FIG. 9.

FIG. 11 is a functional block diagram of one embodiment of a pixel arraythat may be generated by the die setting system of FIG. 9.

FIG. 12 is a functional block diagram of one embodiment of the system ofFIG. 6, with both a die setting system and a material thickness system.

FIG. 13 is a functional block diagram of various components present inone embodiment of the material thickness system of FIG. 12.

FIG. 14 is a functional block diagram of a shaped profile, illustratingcomputations that may be performed by the material thickness system ofFIG. 12.

FIG. 15 is a graphical illustration of various measurements of onedimension of a shaped profile that may be taken by the materialthickness system of FIG. 12.

FIG. 16 is a graphical illustration of various measurements of anotherdimension of a shaped profile that may be taken by the materialthickness system of FIG. 12.

FIG. 17 is a graphical illustration of a simplified measurement of ashaped profile that may be taken by the material thickness system ofFIG. 12.

FIG. 18 is a flow chart illustrating one embodiment of possible stepsthat may be taken in the die setting system of FIG. 9.

FIG. 19 is a flow chart illustrating one embodiment of possible stepsthat may be taken in the material thickness system of FIG. 12.

FIG. 20 is a functional block diagram of a sheet manufacturing system,similar to the system of manufacturing shaped profiles of FIG. 6.

FIG. 21 is an overhead view of the sheet manufacturing system of FIG.20.

FIG. 22 is a functional block diagram of a pixel array with defects,generated by the sheet manufacturing system of FIGS. 20 and 21.

FIG. 23 is a flowchart of possible steps that may be taken to detectdefects in the system of FIG. 20.

FIG. 24A is a screenshot of a typical work product, as illustrated inFIG. 2

FIG. 24B is a screenshot of a typical line camera scan of the workproduct from FIG. 24B.

FIG. 25 is an exemplary diagram of a work product and a reference lineas described with reference to FIGS. 24A and 24B, which can be used todetermine width and control slitters.

FIG. 26 is simulated trend graph of a length measurement on a partshearing operation, similar to the trend graph from FIG. 15.

FIG. 27A is a functional block diagram of a coating technique for a workproduct that employs of both nuclear gauging and Infrared (IR) gauging,similar to the system from FIG. 2.

FIG. 27B is an exemplary depiction of the coating technique from FIG.27A.

FIG. 27C is an additional exemplary depiction of the coating techniquefrom FIG. 27A.

FIG. 28A is a screenshot diagram of output data from a nuclear gaugescanning the width of a moving work product that can be taken from thesystem from FIGS. 27A, 27B, 27C.

FIG. 28B is a sketch of an infrared spectrograph related to themeasurement techniques illustrated in FIGS. 27A, 27B, 27C.

FIG. 29 is a screenshot of a coating measurement taken pursuant to acoating system, similar to the system from FIGS. 27A, 27B, and 27C.

FIG. 30 is a screenshot of a film thickness measurement, similar to thescreenshots from FIGS. 24 and 29.

FIG. 31 is a screenshot data received from an opacity sensor coupled tothe pixel positioning system, as illustrated in FIGS. 24, 29, and 30.

DETAILED DESCRIPTION

Many aspects of the disclosure can be better understood with referenceto the following drawings. The components in the drawings are notnecessarily to scale, emphasis instead being placed upon clearlyillustrating the principles of the present disclosure. Moreover, in thedrawings, like reference numerals designate corresponding partsthroughout the several views. While several embodiments are described inconnection with these drawings, there is no intent to limit thedisclosure to the embodiment or embodiments disclosed herein. On thecontrary, the intent is to cover all alternatives, modifications, andequivalents.

FIG. 1 is a functional block diagram illustrating interconnectivity of apixel positioning system integrated in a network environment. Morespecifically, an operator interface 112 can be coupled to a pixelpositioning system 100. Data may be communicated via an internal (orexternal) network such as Ethernet to the operator interface 112. Theoperator interface can be coupled to a Dynamic Data Exchange (DDE) orTransmission Control Protocol/Internet Protocol (TCP/IP) interface. Alsocoupled to the operator interface 112 may be a plant server 128, whichmay be coupled to at least one network interface 132 a, 132 b.

FIG. 2 is a system for manufacturing continuously produced workproducts, which can be integrated in the system from FIG. 1. Asillustrated, system 100 includes a plurality of visual data capturedevices 52. The video capture devices 52 can include line scan camerastaking pictures of a transmitted light through a work product 2. Thevisual capture devices 52 can take pictures at any rate desired for theparticular manufacturing process. One visual data capture speed commonlyimplemented is around 10 to 20 times per second. While FIG. 2illustrates an embodiment with a plurality of visual capture devices, itis common to have a single camera with around 5000 pixels in a one-linearray that will be processed at a rate of around 60 MHz. This translatesto each pixel being processed 12 times per second. As the work product 2moves along the manufacturing path, illustrated by the arrow from leftto right, the visual data capture devices can capture data related tovarious properties of the work product including defects, abnormalities,and dimensions.

FIG. 3 is an exemplary output data graph that may be produced whenmanufacturing continuously produced work products from systems such asthose from FIG. 2. As illustrated, the data can include a line graph 310representing any of a plurality of data. In at least one embodiment, theline graph 310 illustrates the transmissivity of a work product. Alighting signal can be communicated to the work product, and changes inthe intensity of the light signal typically result when the light signalis reflected/refracted from the defect in the material. In the graph atthe top of the page, the x-axis 314 represents a pixel number associatedwith the visual data capture device from FIG. 2. The y-axis 314 isdisplayed in arbitrary units called a gray scale. In this nonlimitingexample, if the material is completely opaque the line graph 310 canhave a value of “0”. If there is 100% transmission then the line graphcan have a value of 256.

As a nonlimiting example, the following information can be derived fromFIG. 3. First, if the work product is 60 inches wide, then the defect312 can be found at approximately (1990/5000)×60 or 23.88 inches fromthe edge. Additionally, if line speed is also being accumulated, theexact location of the defect can be determined and mapped in any givenroll of work product materials produced.

One should note that the system could include other more advanced logicfeatures that have a different role. One of these advancements can bereferred to as uniformity or formation analysis logic. This logic can beconfigured to compare the uniformity of one given area to another on thesame web. The purpose is to compare the consistency of one area to itscounterpart in another part of the work product. A nonlimiting examplewould be to compare the consistency of bond paper to the blotchiness ofkraft paper.

An additional variation of a comparator technique is called patternrecognition. In the case of repeating patterns such as wallpaper orother printing patterns, the system can be configured to recognize thedesired pattern of light and compare that to any upcoming pattern anddetects any differences.

FIG. 4 is a functional diagram illustrating one approach for capturingdata in manufacturing continuously produced work products, as shown inFIG. 2. As illustrated, visual capture device 52 is illustrated asresiding directly above, and directed in an orthogonal direction as thework product 2 is moving out from the page. A light source 408 islocated opposite the work product 2 from the visual capture device 52,and can be configured to emit a light toward the work product 2.Depending on the particular implementation and work product beingmanufactured, this light will cause the work product 2 to cast a shadow,which visual capture device 52 can perceive. Alternatively, if the workproduct 2 is at least partially translucent, the light source can emit alight signal that shines through the work product 2. The light signalcan then be perceived by visual capture device 52. In either event, thevisual capture device 52 can capture data related to the defect 162located on the work product 2.

FIG. 5 is an alternate functional diagram illustrating another approachfor capturing data in manufacturing continuously produced work products,as shown in FIG. 2. Similar to FIG. 4, this nonlimiting example includesa visual capture device 52, a work product 2 and a light source 408.However, in this nonlimiting example, the light source 408 is located atan angle from the visual capture device 52. The light source is directedto emit a light signal to the work product 2 such that the light signalis reflected from the work product 2, and captured by the visual capturedevice 52.

As is evident to one of ordinary skill in the art, the angle ofreflection depends on the type of work product 2 being produced.Depending on the work product 2, a system operator may desire anadjustment of the relative positions of these components.

Wall Thickness and Shaped Profiles

Consider that an extruder can have a die that defines an opening thatforms the exterior shape of a work product and a mandrel that is fixedin the space of the die and never moves relative to the die. The mandreldefines a center void in the work product and can determine the innerdimensions of the product. If the same mandrel is used, the innerdimensions will always remain the same. Therefore, some of the variablestypically in the extrusion process are the concentricity of the die ringwith respect to the mandrel and the take away speed of theinline-pulling device.

As is evident, when the die is not correctly aligned with the mandrel,the finished product can have an asymmetric shape. Further, thethickness of each wall of the work product will likely vary with respectto the thickness of the other walls. Therefore, a method of accuratelysetting the die is desired.

One method of setting the die implements the use of pixel arrays. At oneor more points along the manufacturing process described above, a firstmeasuring device may be used to measure the width of a side of theproduct. In one embodiment, the first measuring device may have a lightsource that shines on the material, casting a shadow of the product. Onthe opposite side of the product is a sensing device, centered on thelongitudinal axis of the mandrel. The sensing device can receive anddigitize the shadow into a pixel array. Because the center pixel of thepixel array is centered on the mandrel, the sensing device can count thenumber of pixels from the center pixel line to the edge of the shadow ineach direction. If the number of pixels in one direction do not equalthe number of pixels in the other direction, the die is off-center in atleast one direction. Additionally, if the die is “twisted” with respectto the mandrel, the number of pixels consumed by the shadow can begreater than the desired pixel count. This data allows the system todetermine when the die needs to adjustment.

A second measuring device may also be used to measure an alternate sideof the product using the same technique. The number of measuring devicesin the system may vary, depending on the shape and number of sides onthe product. Additionally, reflection techniques and even photographicor video data may also be implemented to allow the sensing device andthe light source to be located on the same side of the product.

As a nonlimiting example, with reference to a 4×4, if one were to shinea light source onto one of the vertical surfaces of the product, theproduct would cast a shadow. The sensing device could detect and convertthe shadow into a pixel array. By counting the number of pixels consumedby the shadow in the vertically up direction and by also using a similarshadow in the horizontal axis and comparing the number of pixelsconsumed by the shadow in the horizontal direction, the operator candetermine if the die is centered with respect to the mandrel.

One should also note that pixel counting is not limited to countingalong the center pixel or reference line. As is evident, counting atdifferent or even multiple pixel lines may provide more information asto correcting the die placement.

One should also note that pixel arrays can be captured by differingtechniques, such as a photographic lens, or a television CRT or LCD.These devices could be described as an area array. There are also linescan cameras that use an array of pixels in a contiguous straight line.These devices can be used on continuing processes such as web productsto determine flaws and other anomalies. If an operator stays within thesame given area, he can move the centerline of any object a precisedistance by counting the correct pixels in the X and Y direction andplacing the same object in a precise new location.

In one embodiment, each dimension of light could be covered by a camerawith 5000 pixels and would scan at a rate of approximately 10 times persecond. Using a 4×4″ extruded post as an example, the resolution of thehorizontal and vertical dimensions are compared with the reference lineof (the line of pixels denoted as (x, 2500)). The operator can firstcheck his screen to determine if the die was centered. If the shadow wasnot equidistant on both sides of the centerline, then the die can becentered around the mandrel or true reference line and could show eachshadow to be equidistant about the known reference line aftercompletion.

A remaining variable is the actual wall thickness of the product. Asstated above, wall thickness can be determined by the speed of thepulling device. Therefore, the proper control of the pulling device canresult in the correct wall thickness. Typically, the pulling deviceincludes two tractor treads around the cooled product controlled by avariable speed motor. Faster speeds reduce the wall thickness and slowerspeeds increase the wall thickness.

Once the die is centered, wall thickness, and therefore width and depthof the product are measured. With the die centered, one can determinethe length of each side of the profile by counting pixels, as describedabove. One method described here takes the length of each side andmultiplies them together. If the calculated value does not equal thedesired value, then the operator can speed up or slow down the pullingdevice.

For example, in the case of a 2×4 product, the method can measure thewidth and height of the product, and can multiply the two measurementstogether to achieve a calculated value. Next, the method compares thecalculated value with a desired value (in this case the desired value is8, which is 2 times 4). If the calculated value is less than 8, then thewall thickness is less than desired and the pulling device needs to slowdown. If, on the other hand, the calculated value is greater than 8,then the wall thickness is too large and the pulling device needs tospeed up. As is evident, the simplification of correcting the productthickness is not constrained to the multiplication of the twomeasurements. Any manipulation of the readings from the sensors may beimplemented to more easily adjust the product thickness.

Referring now to the drawings, FIG. 6 is a functional block diagram ofone embodiment of a system for manufacturing work products, such asshaped profiled materials. As illustrated in FIG. 6, the system includesan extruder 10 for shaping the liquefied or amorphous solid materialinto the desired shaped profile. The extruder 10 includes a mandrel 24and a die 22 (see FIG. 7) that receive the liquefied material andproduce continuously manufactured product 2 a, 2 b, shaped in thedesired shaped profile. Once shaped in the extruder 10, the uncooledcontinuously manufactured product 2 a is sent to the cooling device 12.While the uncooled continuously manufactured product 2 a may be in asubstantially solid state, the cooling device 12 ensures the shape ofthe uncooled continuously manufactured product 2 a, as defined by theextruder 10.

Also included in this embodiment of a system of manufacturing shapedprofiles is a pulling device 14. The pulling device 14 is configured toadvance the continuously manufactured product 2 a, 2 b from the extruder10 and the cooling device 12 to other stations in the manufacturingprocess. The pulling device 14 is configured to pull the continuouslymanufactured product 2 a, 2 b from the cooler. Additionally, since thecooled continuously manufactured product 2 b is coupled to the uncooledcontinuously manufactured product 2 a, the pulling device 14 can alsoact as a thickness determination device. The faster the pulling device14 pulls the cooled continuously manufactured product 2 b, the thinnerthe uncooled continuously manufactured product 2 a will stretch.Similarly, the slower the pulling device 14 pulls the cooledcontinuously manufactured product 2 b, the thicker the uncooledcontinuously manufactured product 2 a will remain.

The pulling device 14 of FIG. 6 includes two cylindrical rollers to pullthe cooled continuously manufactured product 2 b. One should note thatthis is but a nonlimiting example of one type of pulling device. As isevident to one of ordinary skill in the art, any type of pulling devicemay be used to achieve the same result. Similarly, other additions,deletions, and variations of the system disclosed in FIG. 1 are alsoincluded in this disclosure. FIG. 6, as with all examples in thisdisclosure are intended to illustrate, and not to limit.

FIG. 7 is a functional block diagram of one embodiment of a mandrel anddie, located in the system of FIG. 6. As discussed with reference toFIG. 6, the extruder 10 includes a mandrel 24 and a die 22. The mandrel24 may be of any shape, but in this nonlimiting example, thecross-section of the mandrel 24 is square, to produce a 4×4 or similarshaped profile. In some embodiments, the mandrel 24 is configured toremain stationary with respect to the rest of the system. Also includedin the extruder 10 is a die 22 that defines the outer portions of theshaped profile. The die 22 may be adjustable, and is configured suchthat the inner portions of the die 22 are slightly larger than outerportions of the mandrel 24. The mandrel 22 may be placed in a positionto define a shaped aperture 4 for the uncooled continuously manufacturedproduct 2 a to fill.

The mandrel 24 and the die 22 of FIG. 7 are aligned such that the shapedaperture 4 has equal thickness on all sides. More specifically,L₁=L₂=L₃=L₄. This can be illustrated by the fact that the mandrelcenterline 26 a matches up with die center markings 27 a, and mandrelcenterline 26 b is in line with die center markings 27 b. The mandrelcenterlines 26 a, 26 b in this nonlimiting example are configured tomark the center of the mandrel 24. Since the mandrel 24 is stationarywith respect to the rest of the system, this line should remainstationary. Similarly, the die center markings 27 a, 27 b illustrate thecenter of the die on each side. Since the die is adjustable, the diecenter markings 27 a, 27 b may move relative to the mandrel centerlines26 a, 26 b.

FIG. 8 is a functional block diagram of one embodiment of a mandrel anddie, similar to the mandrel and die of FIG. 7, with the die out ofplace. As illustrated in FIG. 8, the die 22 has been shifted to theright, relative to the mandrel 24. As shown, die center markings 27 aare shifted relative to mandrel centerline 26 a. This scenario changesthe thickness of the right and left side of the shaped aperture 4. Asshown, L₃ is different than L₄. Although L₁ and L₂ are equal thickness,they have a different thickness than L₃ and L₄. Such a configurationproduces a shaped profile that is asymmetrical, and in this nonlimitingexample, undesired.

FIG. 9 is a functional block diagram of the manufacturing system of FIG.6, with a die setting system 40. In at least one embodiment, themanufacturing system can be considered a first checkpoint that includesan extruder 10 to shape an uncooled continuously manufactured product 2a. Also included is a cooling device that cools the continuouslymanufactured product 2 b. A pulling device 14 pulls the cooled portionof the continuously manufactured product 2 b. In this nonlimitingexample, a die setting system 40 (which may also be seen as a firstcheckpoint) may also be included to provide information regarding theposition of the die 22. One should note that although die setting system40 is located between the cooling device 12 and the pulling device 14,the present disclosure is not so limited. The die setting system may beplaced anywhere that will achieve the desired results.

FIG. 10 is a functional block diagram of one embodiment of componentsthat may be present in the die setting system of FIG. 9. The die settingsystem 40 of FIG. 10 includes visual data capture devices 52 a, 52 bpositioned along two of the sides of the shaped continuouslymanufactured product 2 a, 2 b. As illustrated, the visual data capturedevices 52 a, 52 b are configured to capture visual data regarding theposition of the continuously manufactured product 2 a, 2 b. The visualdata capture devices 52 a, 52 b may be any type of device capable ofcapturing visual data. The visual data capture devices 52 a, 52 b may beconfigured to capture light, shadow, or other similar data. In at leastone embodiment, the visual data capture devices 52 a, 52 b include acamera and a light source positioned opposite the camera from the workproduct. When the light is illuminated, the camera receives visual datain the form of a silhouette of the work product. An additional exemplaryembodiment of visual data capture devices 52 a, 52 b may include thelight source being positioned on the same side of the work product asthe camera. In this embodiment, the camera captures the light reflectedfrom the light source by the work product. This reflected light may alsobe seen as a silhouette.

The die positioning system 40 is also configured to determine at leastone reference line (see FIG. 11). The die positioning system 40 is alsoconfigured to convert the visual data into a pixel array. In someembodiments, the die positioning system 40 also includes a processor forexecuting the functions described above.

FIG. 11 is a functional block diagram of one embodiment of a pixel arraythat may be generated by the die setting system of FIG. 9. The pixelarray 60 of FIG. 11 illustrates possible data that visual capturedevices 52 a, 52 b may acquire. Additionally, the die setting system 40converts the visual data into a pixel array 60, shown in FIG. 11.Included with the pixel array is a reference line 62. This referenceline 62 indicates the center of pixel array in the horizontal direction.Utilizing reference line 62 in conjunction with the shaped profilevisual data 64 on pixel array 60, the system can determine whether thedie 22 (FIG. 7) is out of position. If the die 22 is out of position,the pixel array 60 will include shaped profile visual data 64 that isshaded in pixels that should not be shaded except in the area defined bypixel markers C through I. If the die is out of position, pixel dataother than in this region will be present. If this occurs the system canperform appropriate measures to correct the problem including, but notlimited to displaying an alert to a user and providing graphics tomanually or automatically adjust the position of die 22.

Although the reference line 62 of FIG. 11 is located at the center ofthe shaped profile visual data 64, this is but a nonlimiting example.Reference lines may be located anywhere on the pixel array to indicate areference point by which die position can be determined. Similarly,although only one reference line 62 is illustrated in FIG. 11, anynumber of reference lines may be used.

FIG. 12 is a functional block diagram of one embodiment of the system ofFIG. 6, with both a die setting system and a material thickness system.Similar to FIGS. 6 and 9, the system of FIG. 12 includes an extruder 10for shaping an uncooled continuously manufactured product 2 a, a coolingdevice 12 for cooling the uncooled continuously manufactured product 2a, and a pulling device 14 for pulling the cooled continuouslymanufactured product 2 b. The system of FIG. 12, however includes thedie setting system 40 from FIG. 9, and a material thickness system 70for defining a desired thickness of the continuously manufacturedproduct 2 a, 2 b. One may note that although FIG. 12 illustrates asystem with both the die setting system 40 and the material thicknesssystem 70, this is but a nonlimiting example, as other embodiments mayinclude only one of the systems. Similarly, the positions of the diesetting system 40 and the material thickness system are also nonlimitingexamples to illustrate one embodiment of the present disclosure.

FIG. 13 is a functional block diagram of various components present inone embodiment of the material thickness system of FIG. 12. In at leastone embodiment, the material thickness system 40 of FIG. 13, can beconsidered a second checkpoint that includes visual data capture devices52 c, 52 d that receive visual data regarding a side of the cooledcontinuously manufactured product 2 b. The visual data capture devices52 c, 52 d may be configured to capture visual data regarding a side ofthe cooled continuously manufactured product 2 b. The visual data canthen be converted to a pixel array, similar to pixel array 60, andassociated with one or more reference lines, such as reference line 62.The visual data capture devices 52 c, 52 d may be similar to the visualcapture devices 52 a, 52 b from FIG. 10, or they may be different,depending on their intended use.

FIG. 14 is a functional block diagram of a shaped profile, illustratingcomputations that may be performed by the material thickness system ofFIG. 12. The cooled continuously manufactured product 2 b may be shapedwith a total height equal to H₁, an inner height equal to H₂, a totalwidth equal to W₁, and an inner width equal to W₂. Referring back toFIG. 13, the visual capture device 52 d receives visual data regardingthe right side of the cooled continuously manufactured product 2 b. Thematerial thickness system 70 can then convert the visual data into apixel array, and perform calculations to determine wall thickness, L₃and L₄. To determine the wall thickness, L₃ and L₄ the materialthickness system 70 can determine the number of pixels along the heightof the shaped profile visual data, as H₁ (see FIG. 11). The system canknow the inner height H₂ in as the height of the mandrel 22 (see FIG.7). By subtracting the data associated with H1 from the data associatedwith the total height of the cooled continuously manufactured product 2b, H₂, the system can determine the combined thickness of L₃ and L₄. Thesystem can then divide this value by 2 to determine the thickness ofeither L₃ or L₄. Similarly, using a similar technique, the thickness ofL₁ and L₂ may also be determined.

One should note that since the die was adjusted to assure equalthickness of each side of the continuously manufactured product 2 a, 2b, one can infer that L₁=L₂=L₃=L₄. Therefore, by subtracting H₁ from H₂,and dividing by 2, the system can determine the thickness of both L₃ andL₄.

Once the appropriate calculations are made, the system can then comparethis data with the desired thickness data. In making this calculation,the system can speed up or slow down the pulling device 14 to moreclosely achieve the desired thickness of the cooled continuouslymanufactured product 2 b. One should note that the calculationsdescribed in this disclosure are intended only to illustrate onepossible example of calculating the thickness of the continuouslymanufactured product 21. 2 b. Other calculations may also be included aspart of this disclosure.

FIG. 15 is a graphical illustration of various measurements of adimension of a shaped profile that may be take by the material thicknesssystem of FIG. 12. As the continuously manufactured product 2 a, 2 b isadvancing, the die centering system 40 and the material thickness system70 are taking measurements and making calculations. FIG. 15 illustratesa graphical representation 1500 of such information with respect to thelength of the short side of a 2×4 shaped profile, with a target of 2.0being desired. As the value increases above 2.0 the thickness ofcontinuously manufactured product 2 a, 2 b is above the desired mark andthe system (or operator) can adjust the pulling device 14 to reduce thethickness of the continuously manufactured product 2 a, 2 b.Alternatively, when the length data falls below 2.0, the system (oroperator) can adjust the pulling device 14 to increase the thickness ofcontinuously manufactured product 2 a, 2 b.

FIG. 16 is a graphical illustration of various measurements of anotherdimension of a shaped profile that may be taken by the materialthickness system of FIG. 12. The graphical representation 110 of thecore side of a 2×4 shaped profile is illustrated with a target value of4.0. Similar to the graphical representation 100 of FIG. 15, the systemcan adjust the pulling device 14 according to the received data.

FIG. 17 is a graphical illustration of a simplified measurement of ashaped profile that may be taken by the material thickness system ofFIG. 12. FIG. 12 represents a graphical representation 120 of thecombined data from FIGS. 16, 17. By combining the data for each side ofthe continuously manufactured product 2 a, 2 b, the system (or a user)can more easily determine how to adjust the pulling device 19 to achievethe desired results. While a graphical representation 100 from FIG. 15is multiplied with the graphical representation 110 from FIG. 16 toachieve the graphical representation 120, this is but a nonlimitingexample.

FIG. 18 is a flow chart illustrating one embodiment of possible stepsthat may be taken in the die setting system of FIG. 9. The first step ofthe flowchart of FIG. 9 is forcing the liquefied material through theextruder (step 131). As discussed above, the continuously manufacturedproduct 2 a, 2 b may be in the form of a liquid or amorphous solid. Whenthe continuously manufactured product 2 a, 2 b is forced through theextruder 10, which includes a mandrel 24 and a die 22, which define theshaped aperture 4, the continuously manufactured product is formed to adesired shape. The next step is to cool the shaped liquefied material(step 132). This may be accomplished using the cooling device from FIGS.6, 9, and 12, or other similar cooling means. The next step is todetermine a reference line (step 133). As discussed above, the referenceline helps the system determine both the position of the die 22, and thethickness of the continuously manufactured product 2 a, 2 b. While thisstep is disclosed after cooling the continuously manufactured product 2a, 2 b, there is not such limitation intended. In actuality, manyembodiments will have determined a reference line before manufacturingbegins.

The next step is to capture visual data of at least one side of theshaped material (step 134). This can be accomplished with visual capturedevices 52 or other similar means. After the visual data is captured,the system can convert the visual data into a pixel array (step 135) andset a line of pixels to correspond with the reference line (step 136).As with determining a reference line (step 133), in many embodiments,the coordination of the line of pixels with the reference line can becompleted before production begins. As such, the placement of this stepis not indicative of the only configuration.

The next step of this flowchart is to determine whether the dimensionsare within the predefined pixel boundary (step 137). If the dimensionsof the continuously manufactured product 2 a, 2 b are not within theacceptable range, the system may perform adjustment procedures (step138). If, on the other hand, the dimensions are acceptable, the systemcan continue manufacture (step 138).

FIG. 19 is a flow chart illustrating one embodiment of possible stepsthat may be taken in the material thickness system of FIG. 12. Similarto the first step in the flowchart of FIG. 13, the first step in theflowchart of FIG. 19 is to force the liquefied material through theextruder (step 140). As stated above, this shapes the uncooledcontinuously manufactured product 2 a into a desired shape. Once theuncooled continuously manufactured product 2 a is shaped, it can becooled (step 141). Cooling the uncooled continuously manufacturedproduct 2 a creates a more rigid structure by which a pulling device 14(see FIGS. 6, 9, 12) can advance the entire web of material. The nextstep in the flowchart of FIG. 19 is to determine a reference line (step142). After determining a reference line, the next step is to capturevisual data of at least one side of the cooled continuously manufacturedproduct 2 b (step 143). Once the visual data is captured, the system canconvert the visual data into a pixel array (step 144), and set a line ofpixels to correspond with the reference line (step 145).

Next, the system can perform calculations to determine the length of themeasured side of the cooled continuously manufactured product 2 b (step146) by comparing the pixel array data with the reference line. Fromthis data, the system can perform calculations to determine thethickness of an adjacent side (step 147). From this information thesystem can determine whether the side thickness is within an acceptablerange (step 148). If so, the system can continue manufacturing (step 149b); if not, the system can increase or decrease the speed of the pullingdevice 14 (step 149 a).

Defect Location

FIG. 20 is a functional block diagram of a sheet manufacturing system,similar to the system of manufacturing shaped profiles of FIG. 6. Inthis embodiment, the extruder 10 may or may not be configured to shapethe continuously manufactured product 2 a, 2 b into a shaped profile.Regardless, visual data capture device 52 e is configured to detectdefects associated with the continuously manufactured product 2 a, 2 busing methods similar to those discussed above. Pulling device 14advances the continuously manufactured product 2 a, 2 b in the directionof the arrow.

FIG. 21 is an overhead view of the sheet manufacturing system of FIG.20. As shown, defects 162 a, 162 b on the continuously manufacturedproduct 2 a, 2 b pass by the visual capture device 52 e. The visualcapture device in this embodiment is configured to detect and locatedefects, which may include any of the following: streaks, spots, holes,formation defects, pattern defects, and opacity defects. The visual datareceived by the visual data capture device 52 e can then be convertedinto a pixel array, and associated with a reference line.

FIG. 22 is a functional block diagram of a pixel array with defects,generated by the sheet manufacturing system of FIGS. 20 and 21. Thepixel array of FIG. 22 illustrates that each defect 174 a, 174 b, 174 c,174 d, and 174 e can be charted according to the pixel array andreference line 62. In this embodiment the continuously manufacturedproduct 2 a, 2 b is advancing in the direction of the arrow, with thereference line 62 being parallel to the direction of advancement. In atleast one embodiment the visual capture device 52 e (from FIGS. 20 and21) records the visual data as a series of “snapshots” that are analyzedindividually for defects. In this scenario, each snapshot labeled, alongwith the location of the defect on that snapshot. Alternatively, thevisual data capture device 52 e can be configured to capture visual datasuch that a single pixel array is created for a continuouslymanufactured product.

FIG. 23 is a flowchart of possible steps that may be taken to detectdefects in the system of FIG. 20. The first step in this flowchart is toadvance the continuously manufactured product (step 191). Then thesystem determines a reference line (step 192). Next, the system capturesvisual data relating to the continuously manufactured product (step193), and converts the visual data into a pixel array (step 194). Then,the system can set a pixel line to correspond with the reference line(step 195). The system can then determine the location of the defectbased on the pixel array (step 196). With this data, removal procedurescan be performed (step 197) and manufacture can continue (198).

Width And Length Measurement

FIG. 24A is a screenshot of a typical work product, as illustrated inFIG. 2. Assuming the lighting is wider than the web, the system couldvery easily detect the edge of the material and because of the pixelpositions across the whole field of view of the camera, it is also veryeasy to tell the difference between the materials edges shrinking orgrowing and the web centerline wandering which gives an apparent edgeshift. As illustrated, FIG. 24A includes a work product 2 that can becontinuously manufactured. The work product has a predetermined width2464 and a continuous length. While the width 2464 is generally designedto remain constant through the manufacturing process (unless cut for aparticular use), the length can be any length. However, for any givenscreenshot, the length will typically have a finite length 2466, and thepredetermined width 2464.

FIG. 24B is a screenshot of a typical line camera scan of the workproduct from FIG. 24B. As illustrated the line camera scan includes anx-axis 2452 and a y-axis 2454. The x-axis 2452 in this nonlimitingexample relates to the number of pixels in a typical width sensor, andthe y-axis 2454 can be any value, depending on other measurements of thework product. Additionally, FIG. 24B illustrates a work product presencesignal 2456 that illustrates the presence of the work product betweenwidth reference lines 2462 a, 2462 b. Outside of width reference lines2462 a, 2462 b are work product absence signals 2458 a, 2458 b. As isevident, the lack of continuity between the work product presence signal2456 and the work product absence signals 2458 a, 2458 b. In FIG. 24B,the work product resides at approximately x=1700 pixels and x=3200pixels. The width reference lines 2462 a, 2462 b may be generated andplaced on an operator station to indicate the desired width position ofthe work product. An operator (or the system itself) may adjust themanufacturing process if the work product presence signal 2456 extendsbeyond the width reference lines 2462 a, 2462 b or if the work productabsence signals 2458 a, 2458 b extend beyond the width reference lines2462 a, 2462 b.

FIG. 25 is an exemplary diagram of a work product and a reference lineas described with reference to FIGS. 24A and 24B. As illustrated, adesired cutting reference line 2562 is shown on a piece of tuftedcarpet. This line is measured and controlled by pixel positions. Whilethe width reference lines 2462 a, 2462 b from FIG. 24B illustrated thewidth boundary of a work product, the desired cutting reference line2562 indicates a desired position for cutting the work product. In atleast one embodiment, width reference lines and sensors can measure theaccuracy of the cut defined by desired cutting reference line 2562 atvarious other points in the manufacturing process.

This same technique can be used for the other dimension, length as well.Some materials are used to make parts such as vinyl siding and lightinglenses. Because the data is accumulated so rapidly it is relatively easyto gather data on the length dimension as well. The camera systemsketched in FIG. 2 could measure the length of any given part to lessthan 1/10 of an inch for any line running at speeds of 60 feet perminute (FPM) or less.

FIG. 26 is simulated trend graph of a length measurement on a partshearing operation, similar to the trend graph from FIG. 15. Asillustrated, this graph includes a desired length 2652, which has avalue of 36.0. The measurement points 2654 a-2654 g illustrate theparticular measurement taken, and indicate a trend of the work productover a predetermined distance. In this particular nonlimiting example,the trend for the work product length is increasing beyond the desiredlength of 36.0. Therefore, material costs are increasing and workproduct quality is decreasing. By supplying this data to an operator orsystem computer, adjustments can be made perhaps in real time and saveboth time and money.

Coating Measurement

For various reasons a coating material may be applied to a work productduring manufacture. Depending on the particular work product, theparticular coating applied, and the desired use of the final product, apredetermined coating thickness or coating weight is generally desired.As discussed above, variance from the predetermined desired measurementscan reduce quality and increase raw material costs.

FIG. 27A is a functional block diagram of a coating technique for a workproduct that employs of both nuclear gauging and Infrared (IR) gauging.The uncoated work product 2 is measured by the first gauge 2702, whichis called the base gauge. The device 2704 applies the coating and thecoated material is measured again by the gauge device 2706, which iscalled the total gauge. The base signal from the base gauge 2702 issubtracted from the total signal generated by total gauge 2706 and thenet result is the weight or thickness of the coating applied.

FIG. 27B is an exemplary depiction of the coating technique from FIG.27A. As illustrated from this top view, the coating 2720 is applied tothe work product 2 by device 2704. The measurement from the base gauge2702 is subtracted from the measurement from total gauge 2706 and thenet result includes the weight or thickness of the coating applied.

FIG. 27C is an additional exemplary depiction of the coating techniquefrom FIG. 27A. In this case the IR gauge is looking at the coating withtwo different near infrared wavelengths. By comparing these two signalsthe gauge can measure the coat weight directly without having to measurethe base material as shown in the above example using nuclear gauging.

FIG. 28A is a screen shot diagram of out put data from either gaugingsystem scanning the width of a moving work product that can be takenfrom FIGS. 27A, 27B, 27C. As illustrated, the coating measurementsapproach a desired value at approximately x=8.8(2804) and x=32(2804 b).Between these values the coating measurement reaches an error ofapproximately 4%. While the discussed techniques can perform variouscoating measurements, the present disclosure also includes a similarmeasurement technique to develop the same data described in FIG. 28Awithout the using a scanner that traverses the width of the workproduct.

FIG. 28B is a sketch of an infrared spectrograph related to themeasurement techniques illustrated in FIG. 27C. The x-axis representsthe wavelength of light. In general, this is plotted over a range in theinfrared frequency region (i.e. above the visible light spectrum, whichcan include a range of 0.8 microns to as high as 15 microns). The y-axis represents a percent transmission. When light impinges on a pieceof material the light will typically be reflected, scattered, absorbedand transmitted. The y- axis in FIG. 28B provides a value for thescattered, absorbed and transmitted portions of the four events. Ingeneral terms the reflected portion is small, typically less than 4% ofthe original beam and is generally constant except when the incidentmaterial approaches 12 microns in thickness. For the purpose of thisdiscussion the reflected light will always be considered constant.

Absorption is directly related to the mass of the material beinginvestigated. If one can measure the amount of absorbed light at certainwavelengths this data can be used to make an absolute measurement of thematerial being produced in real time. From FIG. 28B, when λ₁ 2820 iscompared to λ₂ 2822 the real difference in percent transmission is dueto absorption and thus a continuous measurement can be made by comparingthese signals and the proper calculation made in the software.

FIG. 29 is a screen shot of a coating measurement taken pursuant to acoating system, similar to the system from FIG. 27C. As illustrated thisdata represents data captured by two cameras taking line scans ofreflected light. If these two cameras have an appropriate narrow bandpass filter over each lens, it is possible to generate two distinctsignals 2952, 2954. These two signals can relate to the absorptioncharacteristics of the coating materials as determined by real IRspectroscopy and sketched in FIG. 28B. The first signal wavelength 2952can be a reference wavelength and the other signal wavelength 2954 canrepresent an appropriate absorption wavelength. From these two signalsan appropriate measurement can be made to the coating weight to developthe software graphics illustrated in FIG. 28A.

By taking advantage of these techniques, various benefits can berealized. First since the field of view of the plurality of cameras cancover the entire web surface, the measurement can cover the entire webcontinuously. The camera capabilities and web size may generallydetermine the number of cameras desired. Second, because the camera (orcameras) is fixed, each signal can be taken from the same point in theproduction direction flow, thus eliminating any variation affects to themeasurement from the product. Thirdly, because full web coverage withthe cameras is achieved, the system does not require a scanner. Withfewer moving parts there are typically fewer maintenance issues. Fourth,the system can be configured to provide three-dimensional graphics realtime, without the requirement to use radiation. Fifth, pixel and grayscale values can be grouped properly to provide the system with theproper information to automatically control the coating whether it wasput on by a roll coater or a slot die. In addition, it is entirelypossible that that the control scheme will be improved because thesoftware does not have to wait until an individual sensor traverses theweb for determining the coating weight across the entire sheet and thusthe response time of the control would be improved.

Film Thickness Measurement

FIG. 30 is a screen shot of a film thickness measurement as the film isbeing extruded, similar to the screen shot in FIG. 29 where a coatingmeasurement is being made. In this nonlimiting example, light can betransmitted through the film and the cameras can be directed toward thelight from a position over the sheet similar to the configurationillustrated in FIG. 2. As in the case of the coating measurement, twodifferent wavelengths can measure the thickness of the polymer beingextruded. In addition, one or more of these same cameras could look atthe overall width of the material and distinguish between web wander andactual width changes. Simultaneously one or more of the cameras canconfigured to search for defects such as carbon spots and also measurechanges in light transmissivity that are related to the opacity of thefilm.

It is also conceivable that this measurement data can be used in theautomatic control of the process in lieu of a traditional scanningsensor. As a nonlimiting example, by grouping the gray scale data bypixel position to the number of die bolts on the extruder die, the datacan be used to adjust the die and make a more uniform product. Similarlythe average of all the gray scale data can be compared to the sheetaverage and used as a reference point for auto control. Some of the mainadvantages of the camera pixel system are the removal or reduction ofradiation, no scanning sensor, virtually no moving parts, andpotentially faster automatic control times. Perhaps the most attractivefeature of all, is that all of the camera measurement techniques can bemade with existing hardware and new developments are not required.

Opacity

Opacity is a measure of the inverse of light transmission through amaterial. If a material is completely transparent, it can be assigned agrayscale value of 256 to a camera system. Alternatively, if thematerial is completely opaque it can be assigned a grayscale value ofzero. Grayscale values between 0 and 256 are reserved for varyingopacity of materials.

In at least one nonlimiting example, a piece of film from a trash bagcan be made to appear opaque, thereby hiding the contents within.However, if the film is laid directly on a printed page the print iseasily read through the trash bag. Because the trash bag needs only tobe partially opaque, measurement and control of this component isdesired.

Tappi has a procedure to determine the opacity level of a given film foroptimum printing conditions. As a nonlimiting example, one can assume adesired opacity value of 60% opaque, which is opaque enough to appearcompletely opaque from most distances. If the actual material opacity is65% opaque or 75% opaque, a casual observer will typically be unable tonotice any difference, as all three materials will likely look the same.Thus, it is advantageous to measure opacity in absolute units to insurethat the correct amount of additives is being used because the use ofmore additives is not detectable and does not enhance the visualperformance of the material.

FIG. 31 is a screenshot data received from an opacity sensor coupled tothe pixel positioning system, as illustrated in FIGS. 24, 29, and 30. Asdiscussed above, the work product may include various components tomeasure and control. As illustrated an opacity signal 3154 can bemeasured and compared with a desired opacity reference line 3156. If thegrayscale value decreases, the material is becoming more opaque.Conversely, if the grayscale value increases, the work product isbecoming more translucent. One reason for making an on-line measurementis to reduce the use of raw materials as additives and to certify thatthe proper opacity values are being met. By continuously measuring theopacity while the work product is being produced, adjustments can bemade more quickly to provide a higher quality product, and reduce costsin the use of raw materials.

One should also note that while certain measurements are explicitlydescribed in this disclosure, other measurements can also be made,pursuant to the techniques disclosed herein. As a nonlimiting example,other measurements such as moisture content, temperature, and othermeasurements are also included in the scope of this disclosure.

It should be emphasized that many variations and modifications may bemade to the above-described embodiments. All such modifications andvariations are intended to be included herein within the scope of thisdisclosure and protected by the following claims.

1. A continuous manufacturing process, comprising: advancing a workproduct in a direction along a processing path; establishing a referenceline along the processing path; directing a light signal on one side ofthe processing path to establish silhouette data; capturing silhouettedata related to the work product; converting the silhouette data into apixel array; and setting a predetermined line of pixels to correspondwith the reference line.
 2. The process of claim 1, further comprisingdetermining the position of a terminal boundary of the work productbased on data from the pixel array.
 3. The process of claim 1, furthercomprising using the pixel array to determine whether the work productis out of position with respect to the reference line.
 4. The process ofclaim 1, further comprising using the pixel array to locate at least onedefect in the work product.
 5. The process of claim 4, wherein thedefect includes at least one of the following: a pattern error, aformation error, an opacity defect, a work product thickness defect, acoating defect, a defect related to the width of the work product, and adefect related to the length of the work product.
 6. The process ofclaim 1, further comprising using the pixel array to determine thicknessdata of at least one side of the work product.
 7. The process of claim6, further comprising adjusting the speed of advancing the work productin response to a change in the thickness data.
 8. The process of claim7, further comprising calculating a target number from the thicknessdata, the target number configured to assist in determining a desiredspeed for the pulling device.
 9. A system for continuously manufacturinga shaped profile material, comprising: a mandrel configured to define aninner boundary of the shaped profile material; a die configured todefine an outer boundary of the shaped profile material; a firstcheckpoint that includes a first visual data capture device, first thevisual data capture device configured to capture visual data relating toa dimension of the shaped profile material; first logic configured toconvert the visual data into a pixel array; and a material advancingdevice configured to advance shaped profile material along a direction.10. The system of claim 9, wherein the first checkpoint is configured toallow for adjustment of the die to a desired position.
 11. The system ofclaim 9, further comprising a cooling device configured to cool theshaped profile material.
 12. The system of claim 11, further comprisinga second checkpoint, the second checkpoint including a second visualdata capturing device configured for capturing visual data relating tothe thickness of a dimension of the cooled shaped profile material. 13.The system of claim 12, wherein the visual data related the thickness ofthe dimension of the shaped profile is converted into a pixel array. 14.The system of claim 12, wherein the second checkpoint is configured toallow for adjustment of the material advancing device based on thedetermined thickness of dimension of the cooled shaped profile material.15. The system of claim 12, wherein the second visual data capturedevice includes an infrared device.
 16. The system of claim 9, whereinthe first visual data capture device includes an infrared device. 17.The system of claim 9, further comprising second logic configured todetermine at least one parameter of the shaped profile material from thepixel array.
 18. The system of claim 17, wherein the second logic isconfigured to determine data relating to at least one of the following:a length measurement, a width measurement, a thickness measurement, apattern error, a formation error, an opacity defect, a work productthickness defect, a coating defect, a defect related to the width of thework product, moisture content, and a defect related to the length ofthe work product.
 19. A pixel positioning system, comprising: a visualdata capture device, the visual data capture device configured tocapture visual data relating to a continuously manufactured work productmoving along a processing path; first logic configured to convert thevisual data into a pixel array, wherein the pixel array is associatedwith a reference line, wherein the reference line is configured foralignment with a predetermined point on the continuously manufacturedwork product; and second logic configured to determine and locate adefect on the continuously manufactured work product based oninformation from the pixel array.
 20. The pixel positioning system ofclaim 19, wherein the visual capture device includes at least one of thefollowing: a camera, a line scan camera, an Infrared (IR) blockingfilter, and a light source.
 21. The pixel positioning system of claim19, wherein the defect includes at least one of the following: a patternerror, a formation error, an opacity defect, a work product thicknessdefect, a coating defect, a defect related to the width of the workproduct, and a defect related to the length of the work product.